JPH0219702Y2 - - Google Patents
Info
- Publication number
- JPH0219702Y2 JPH0219702Y2 JP14754783U JP14754783U JPH0219702Y2 JP H0219702 Y2 JPH0219702 Y2 JP H0219702Y2 JP 14754783 U JP14754783 U JP 14754783U JP 14754783 U JP14754783 U JP 14754783U JP H0219702 Y2 JPH0219702 Y2 JP H0219702Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- case
- lead wire
- terminal
- vibration sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 68
- 229910052751 metal Inorganic materials 0.000 claims description 68
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 27
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000221535 Pucciniales Species 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
Landscapes
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14754783U JPS6054935U (ja) | 1983-09-26 | 1983-09-26 | 振動センサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14754783U JPS6054935U (ja) | 1983-09-26 | 1983-09-26 | 振動センサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6054935U JPS6054935U (ja) | 1985-04-17 |
| JPH0219702Y2 true JPH0219702Y2 (en]) | 1990-05-30 |
Family
ID=30328078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14754783U Granted JPS6054935U (ja) | 1983-09-26 | 1983-09-26 | 振動センサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6054935U (en]) |
-
1983
- 1983-09-26 JP JP14754783U patent/JPS6054935U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6054935U (ja) | 1985-04-17 |
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